EMI/RFI shielding for semiconductor device packages

ABSTRACT

An encapsulated semiconductor device package with an overlying conductive EMI or RFI shield in contact with an end of a grounded conductive component at a lateral side of the package, and methods of making the semiconductor device package.

FIELD OF THE INVENTION

The present invention relates generally to semiconductor devicepackages, and more particularly to semiconductor device packages withshielding against electromagnetic (EM) and/or radio frequency (RF)interference, and methods for forming the devices and packages.

BACKGROUND OF THE INVENTION

As semiconductor devices continue to decrease in size and increase indensity, a primary challenge relates to reduction of electromagnetic(EM) and radio frequency (RF) interference, or other inter-deviceinterference which can adversely affect the operation and performance ofneighboring devices. EM and RF interference is the undesired electricalor radio signals or noise in the electronic system circuitry of a devicecaused by the unintentional coupling of EM or RF field energy fromexternal sources. Such external sources include, for example, wires,printed circuit board conductors, connector elements and pins, cables,and other circuitry of nearby devices.

For semiconductor packages used in wireless systems, a shield may beused to protect the electronics of the device from unintended EM or RFenergy. The shield also functions to prevent unintended radiation of EMenergy from the electronics of the device to other circuitry.

Various attempts have been made to shield semiconductor packages fromundesirable EM or RF interferences by applying a shielding layer overthe encapsulated device package with the shielding layer connected toground using a grounding wire or external connection. However, suchtechniques increase the cost and complexity of the packaging process. Inaddition, there is no known shielding technique that can be applieduniversally to a variety of device package types, and that is alsoreliable and cost effective.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention are illustrated by way of exampleand are not limited by the accompanying figures, in which likereferences indicate similar elements. Elements in the figures areillustrated for simplicity and clarity and have not necessarily beendrawn to scale.

FIG. 1 is a plan view of a partially-completed semiconductor devicepanel according to an embodiment of the invention, showing semiconductordies mounted on a substrate panel.

FIG. 2 is a cross-sectional, side view of the semiconductor device panelof FIG. 1, taken along line 2-2.

FIG. 3 is a plan view of the semiconductor device panel of FIG. 1, at asubsequent process step showing a conductive component mounted on thesubstrate panel.

FIG. 4 is a cross-sectional, side view of the semiconductor device panelof FIG. 3, taken along line 4-4.

FIG. 5 is a plan view of the semiconductor device panel of FIG. 3, at asubsequent process step showing wirebonding of the dies and conductivecomponent.

FIG. 6 is a cross-sectional, side view of the semiconductor device panelof FIG. 5, at a subsequent process step showing encapsulation of thedies and conductive component.

FIG. 7 is a plan view of the semiconductor device panel of FIG. 5, at asubsequent process step showing a saw street.

FIG. 8 is a cross-sectional, elevational view of the semiconductordevice panel of FIG. 7, taken along line 8-8.

FIG. 9 is a cross-sectional, side view of the semiconductor device panelof FIG. 8, at a subsequent process step showing the singulatedencapsulated device packages.

FIG. 10 is a cross-sectional, side view of a singulated encapsulateddevice package of FIG. 9, at a subsequent process step showingapplication of a conductive shielding layer over the package.

FIG. 11 is a cross-sectional, side view of a device package undergoing astep of applying a conductive shielding layer over the device package,in accordance with an embodiment.

FIG. 12 is a cross-sectional, side view of semiconductor device packageaccording to another embodiment the invention.

FIG. 13 is a cross-sectional, side view of a semiconductor devicepackage according to yet another embodiment the invention.

FIG. 14 is a cross-sectional, side view of a partially-formedsemiconductor device panel prior to singulation according to anotherembodiment of the invention.

FIG. 15 is a cross-sectional, side view of a singulated one of thesemiconductor devices of FIG. 14, at a subsequent process step showingapplication of a conductive shielding layer over the device package.

FIG. 16 is a cross-sectional, side view of a partially-formedsemiconductor device panel according to yet another embodiment of theinvention.

FIG. 17 is a cross-sectional, elevational view of the semiconductordevice panel of FIG. 16, at a subsequent process step showing additionalpackage layers and saw streets.

FIG. 18 is a cross-sectional, side view of one of the semiconductordevices of FIG. 17 after singulation, and at a subsequent process stepshowing application of a conductive shielding layer over the singulatedencapsulated device package.

DETAILED DESCRIPTION

Embodiments of the invention generally include semiconductor devices,packaged devices, and methods for forming the devices and packages. Thedevice packages are structured with a conductive shield layer on the topand sides (e.g., side of mold compound) of the encapsulated devicepackage, with the shield electrically connected to a grounded conductivecomponent at a side of the package. As used herein, reference to the“top” of a die refers to a surface of a die that is oriented away from asubstrate to which the die may be coupled, where the surface of the diethat is oriented toward the substrate may be referred to as the “bottom”of the die. Similarly, reference to the “top” of a device package refersto a surface of the device package that is opposite the surface to whichthe device package will be coupled to another substrate (e.g., a printedcircuit board (PCB)), where the surface of the device package that iscoupled to the other substrate (e.g., the surface at which conductiveballs are attached) is referred to as the “bottom” of the devicepackage. Reference to “sides” of a die or device package refers tosurfaces of the die or device package extending between the top andbottom surfaces.

The description and Figures convey a process for forming multiplepackaged semiconductor devices by attaching multiple die and conductivecomponents to multiple “package areas” on a common substrate (e.g., aBGA substrate), where a “package area” is a portion of the commonsubstrate corresponding to a single packaged device, once the substrateis singulated. For example, multiple package areas may be arranged in astrip (e.g., the multiple package areas may be arranged in a 1×N strip,where N corresponds to the number of package areas, and N total packageddevices can be simultaneously fabricated), or in an array (e.g., themultiple package areas may be arranged in an A×B array, where A is thenumber of rows of package areas, and B is the number of columns ofpackage areas, and the total number of packaged devices that can besimultaneously fabricated is equal to A times B). In the Figures, theillustrated embodiments show portions of an array or strip that includetwo adjacent package areas to which two die and a conductive componentare coupled to a common substrate (or “substrate panel”, such as a BGAstrip, array, or panel). The die and the conductive component are thenencapsulated to complete a device panel, and a singulation process isperformed through a “saw street” that extends through the encapsulant,conductive component, and substrate. The singulation process separatesthe device panel into two packaged semiconductor devices. Morespecifically, a first die is coupled to a first package area on a topsurface of the substrate, a second die is coupled to a second packagearea on the top surface of the substrate, and the conductive componentis coupled to the top surface of the device substrate so that theconductive component spans from the first package area across to thesecond package area. Those of skill in the art would understand that theprocess may be extended to fabricating more than two packagedsemiconductor devices (e.g., by attaching more than two die to a commonsubstrate with more than two package areas, such as a strip or array ofpackage areas, encapsulating the die, and performing a singulationprocess to separate the package areas). Further, in theory, embodimentsof methods for forming packaged semiconductor devices could be formedone device at a time.

In any event, the singulation process defines individual encapsulateddevice packages, and as will be explained in more detail below, exposesthe conductive component at a sidewall of the singulated device. Morespecifically, prior to singulation, the conductive component spans thespace between the device areas through which the singulation process isperformed (e.g., the “saw street”). After singulation, the conductivecomponent is exposed at a sidewall of the encapsulated and singulateddevice package, and a shielding layer subsequently is coupled directlyto the exposed portion of the conductive component. The shielding layerand conductive component can be coupled to ground (or to another voltagereference) when the device package is incorporated into a largerelectrical system. The conductive component can be incorporated into andadapted for use in a variety of device package types (e.g., ball gridarray (BOA) packages (including wire-bonded molded array process BGA(MAPBGA) packages) fan out wafer level packages (FO-WLP), and flatno-leads (e.g., QFN and DFN) device packages, to name a few).Embodiments of the invention may provide a cost effective device packagewith an integrated and reliable EMI and/or RFI shield. Furtherlimitations and disadvantages of conventional processes and technologieswill become apparent to one of skill in the art after reviewing theremainder of the present application with reference to the drawings anddetailed description which follow.

FIGS. 1 to 13 illustrate plan and cross-sectional side views of asemiconductor device panel at various stages of manufacture. Theillustrated embodiments correspond to formation of encapsulatedsemiconductor device packages in the form of MAPBGA packages, which areenclosed with EMI or RFI shielding according to various embodiments ofthe invention. FIGS. 1-2 illustrate plan and cross-sectional, side viewsof an embodiment of a partially-formed semiconductor device panel 10 ata stage at which a plurality of semiconductor dies 12 a, 12 b have beenmounted on a substrate panel 14 in two adjacent package areas. In theillustrated embodiment, the substrate panel 14 includes a single layerof dielectric material, two conductive layers at top and bottom surfacesof the dielectric material layer, and conductive structures (e.g., vias)that extend through the dielectric material layer and establishelectrical connections between conductive elements of the conductivelayers through the dielectric material. In an alternate embodiment, thesubstrate 14 may be a multi-layer laminate substrate panel, with one ormore additional conductive layers embedded within dielectric materiallayers. The substrate panel 14 shown in FIGS. 1-8 supports a pluralityof dies, and the substrate panel will be encapsulated and singulatedinto individual device packages at a later process step. Typically, oneconductive layer (e.g., a top layer, from the perspective of FIG. 2) ofthe substrate panel further includes electrically conductive traces, andanother conductive layer (e.g., a bottom layer, from the perspective ofFIG. 2) includes contact pads on which external contacts (e.g., solderbumps) are attached for connection of the individual encapsulated devicepackages to a PCB or other external circuitry.

As shown, the substrate panel 14 includes one or more contact pads 16 a,16 b formed from a first conductive layer at a first (e.g., top) surface18 of the substrate panel 14. Although not shown in FIG. 1 or 2, asolder resist layer may be formed over the first conductive layer, whereopenings in the solder resist layer may expose the contact pads 16 a, 16b. Accordingly, reference to a contact pad being “at” or “on” a surfaceof the substrate panel 14 means that the contact pad may be formed froma conductive layer that overlies the surface of the substrate panel 14,or the contact pad may be exposed (e.g., through openings in a solderresist layer) at the surface of the substrate panel 14. Although FIG. 2shows vias 20 that are directly aligned with contact pads 16 b forpurpose of ease of illustration, in actuality the vias 20 and contactpads 16 b may not be directly aligned with each other, but rather may beoffset from each other. For example, the contact pads 16 a, 16 b may beelectrically connected to one or more conductive signal traces (notshown) formed on the surface 18 and/or within layers (not shown) of thesubstrate panel 14. Both the contact pads 16 a, 16 b and traces can beformed using conventional substrate manufacturing processing, forexample, by photo masking, etching and/or an electrolytic or electrolessplating process. In various embodiments, the contact pads 6 a, 16 b canbe formed from copper (Cu), titanium (Ti), nickel (Ni), gold (Au),silver (Ag), other metals, a metal alloy, a conductive polymer, oranother suitable electrically conductive material. In an embodiment, thecontact pads are formed from copper (Cu) with nickel gold (NiAu)plating.

One of the substrate contact pads 16 a, 16 b is a ground contact pad(here 16 b), which may be electrically connected to a ground electricalcontact (e.g., through a solder bump) or other grounding element whenthe device is incorporated into a larger electrical system. In theembodiment illustrated in FIG. 2, contact pad 16 b may be connected toground, as for example, through an electrical interconnect 20 (e.g., aconductive via) through the substrate panel 14, to a contact pad 21 a onwhich a solder bump (42 a; FIG. 6) can be attached. In the embodimentdepicted in FIGS. 1 and 2, the bottom surfaces 22 of dies 12 a, 12 b aremounted on the surface 18 of the substrate panel 14 using adhesive(e.g., epoxy, polymer composite), solder, sinterable ink, or otherbonding material 24. The dies 12 a, 12 b have contact pads 26 on theirtop surfaces, which are electrically connected to circuit elementsformed within the die. In an alternate embodiment, the dies 12 a, 12 bmay be flip-chip mounted to the top surface 18 of the substrate panel14. More specifically, the dies 12 a, 12 b may have contact pads ontheir bottom surface, and those contact pads may be coupled tocorresponding contact pads on the top surface 18 of the substrate panel14. In such an embodiment, translation of the pitch of the die contactpads may be made using traces on or within the substrate panel 14. Thecontact pads 26 can be a metal, a metal alloy, a conductive polymer, oranother suitable electrically conductive material.

Referring now to FIGS. 3-4, according to an embodiment of the invention,a conductive component 28 is coupled to the substrate 14 between dies 12a, 12 b of adjacent devices (e.g., spanning the “saw street” between thedevices). As will be explained in more detail later, the conductivecomponent 28 will provide an electrically conductive contact at thesidewall of each singulated, encapsulated device package. The conductivecomponent 28 can be a metal (e.g., Al, Cu, Ti, Sn, Ni, Au, Ag), a metalalloy, a conductive polymer, or another suitable electrically conductivematerial. According to an embodiment, the conductive component 28 is arigid conductive structure (e.g., a conductive “link”), which ispre-formed prior to attachment to the substrate 14. Alternatively, theconductive component can also be a multi-layered element. In still otherembodiments, the conductive component 28 may be formed in-situ on thesurface of the substrate 14.

The conductive component 28 is designed and structured with a bridgingsection 30 that extends between the package areas to which the two dies12 a, 12 b are coupled. In an embodiment, the bridging section 30 can beelevated above or distanced from (by a distance “d”) the surface of thesubstrate panel 14. In an embodiment, the conductive component 28 has anarch configuration as shown in FIGS. 3-4. This enables the bridgingsection 30 to be elevated above the conductive layer at the top surface18 of the substrate panel 14. For example, in some cases, the conductivelayer at the top surface 18 of the substrate panel 14 may have a platingbus or other conductive feature at the edge of the package area, andelevating the bridging section 30 above such a conductive featurefacilitates later formation of a conformal shield 54 (FIG. 10) thatcontacts only the conductive component 28 (and not the plating bus orother feature). In an alternate embodiment, the conductive component maybe in the form of a block that contacts the top surface of the substratepanel 14 across an entire width of the conductive component (i.e., theconductive component does not include a bridging section that iselevated above the surface of the substrate panel 14).

In a subsequent singulation of the encapsulated dies (e.g., as will bediscussed in conjunction with FIGS. 7-9), the bridging section 30 is cutat or about central section 31 (FIG. 4). The cut end of the bridgingsection 30 is thus exposed at a lateral side of the singulated package.As will be explained in conjunction with FIGS. 10 and 11, later, ashielding layer is then applied over the package including the exposedcut end of the bridging section 30 of the conductive component 28.Structuring the bridging section 30 of the conductive component with anarched section or the like that is distanced (e.g., by distance d) fromthe surface 18 of the substrate panel 14, as depicted in FIG. 4 allowsthe shielding layer to be applied to the exposed end of the conductivecomponent and yet spaced apart from the surface 18 of the substratepanel 14 to avoid shorting of the conductive component 28 and theshielding layer itself to the conductive layer at the surface 18 of thesubstrate panel 14. In embodiments, the distance (d) between the surface18 of the substrate panel 14 and the bridging section 30 can range fromabout 5 microns to about 250 microns. Alternatively, the distance canrange from about 50 microns to about 100 microns. In other embodiments,the distance may be greater than 250 microns.

In an embodiment, the conductive component 28 can be a pre-formedelement that is mounted on the substrate panel 14, for example, usingadhesive or other bonding material 32, as shown in FIGS. 3-4. Theconductive component 28 can be pre-formed by a conventional process suchas, for example, injection molding, casting, machining, punch pressing,roll forming, stamping, blow molding, compression molding, extrusionmolding, transfer molding, thermoforming, substantive etching oradditive printing, among other processes.

The conductive component 28 can also be formed on the substrate panelin-situ prior to or after attachment of the dies 12 a, 12 b onto thesubstrate 14. For example, the conductive component 28 can be fabricatedon the substrate by multiple iterations of a deposition process, anelectroplating process, a lamination technique, or a printing processsuch as an additive printing process, or by an additive or subtractiveprocess in which one or more thick conductive layers are deposited toform the conductive component 28. Other processes also could be used toform conductive component 28 in-situ.

The conductive component 28 is generally sized and shaped to fit on thesubstrate panel between dies of two adjacent package areas, e.g.,between dies 12 a, 12 h. For illustrative purposes, the conductivecomponent 28 can be dimensioned, for example, with a width (w) of about25-500 microns and a length (I) of about 300-5000 microns. In otherembodiments, the dimensions of the conductive component may be larger orsmaller than the above-given dimensions. In any event, according to anembodiment, the cross-sectional area of the bridging section 30 is in arange of about 0.002 mm² to about 50 mm². The cross-sectional area ofthe bridging section 30 corresponds to the area of the conductivecomponent 28 that later will be coupled to conformal shield 54 (FIG.10). Such a cross-sectional area is sufficient to ensure good electricalcontact with the conformal shield 54, once it is applied to the device(e.g., as shown in FIG. 10). In other embodiments, the cross-sectionalarea of the bridging section 30 may be larger or smaller than theabove-given range.

Referring now to FIGS. 5 and 6, dies 12 a, 12 b are wirebonded tocontact pads 16 a, and the conductive component 28 is wire bonded tocontact pads 16 b. For example, as illustrated, the contact pads 26 ofdies 12 a, 12 b can be electrically coupled to contact pads 16 a on thesubstrate panel 14 by bonding wires 38 a (only one of which is shown,although there may be multiple bonding wires interconnecting othercontact pads of dies 12 a, 12 b to other contact pads 16 a on thesubstrate panel 14). Similarly, the conductive component 28 can beconnected by bonding wires 38 b to the ground contact pads 16 b (onlyone of which is shown, although there may be multiple bonding wirescoupling the conductive component 28 to one or more ground contact pads16 b).

As shown in FIG. 6, an encapsulation process can then be performed tocover the dies 12 a, 12 b and the conductive component 28 with a moldingcompound or encapsulant 40. The molding compound is then set or cured toa solid phase. The molding compound is non-conductive and can be made,for example, of a silica filled thermosetting epoxy resin, for example,a novolac epoxy resin-based compound or other polymer material, whichproduces a rigid plastic body surrounding the dies 12 a, 12 b and theconductive component 28. Encapsulation of the dies can be conducted, forexample, by transfer molding, stencil printing, compression molding, andthe like.

External contacts 42, 42 a (e.g., solder ball contacts or bumps) canthen be attached to ball pads 21, 21 a exposed on the bottom (second)surface 44 of the substrate panel 14, as also shown in FIG. 8. Theexternal contacts 42, 42 a are later used in connecting the singulated,encapsulated device packages as a component to an external electricalcircuit or device (e.g., PCB). External contacts 42, 42 a can be formedof an electrically conductive solder material, other metal, alloy orsuitable conductive materials. External contacts 42, 42 a can beattached using conventional semiconductor assembly processes andequipment. For example, the contacts 42, 42 a can be attached byapplying and reflowing a solder material to bond the contacts 42, 42 ato the ball pads 21, 21 a on the substrate panel 14. External contacts42, 42 a can also be formed on the substrate panel by conventionalprocesses such as, for example, stenciling, screen printing,electroplating, electroless plating, evaporation, and the like.

Once completed, the encapsulated device panel 10 can then be cut, sawnor otherwise singulated along a saw street 46, as illustrated in FIGS. 8and 9, to form individual, encapsulated device packages 48 a, 48 b. Thesaw street 46 is positioned between the dies 12 a, 12 b and theircorresponding package areas. The singulation process cuts through theencapsulant 40, the conductive component 28, and the substrate panel 14.As shown in FIG. 9, each singulated, encapsulated device package 48 a,48 b includes a section 28 a, 28 b of the conductive component 28, whichis exposed along a lateral side 52 of each of the device packages. Asindicated previously, section 28 a, 28 b corresponds to a cross-sectionof the bridging area 30. Singulation can be performed using mechanicalsawing, laser ablation, and the like.

As illustrated in FIG. 10, a conductive shielding material is thenapplied to top and side exterior surfaces of the package body to form aconformal EMI and/or RFI shield coating 54. The shield coating 54 isformed from an electrically conductive material and substantiallysurrounds the top and portions of the side surfaces of the encapsulatedpackage 48 b to provide protection against EM and/or RF interferencefrom external sources, and/or to prevent the encapsulated device package48 b from producing EM and/or RF interference that may compromise theperformance of other components of a system.

According to the invention, the outer surface 56 of the encapsulant 40of the device package 48 b including the exposed terminal end 50 of theconductive component 28 b is coated with the conductive shieldingmaterial 54, as illustrated in FIG. 10. As such, the conductivecomponent 28 b is electrically connected directly to the conductiveshield layer 54. The conductive component 28 b is also connected to aground contact pad 16 b on the substrate panel 14 through wire bond 38b. As illustrated, in an embodiment, the ground contact pad 16 b is, inturn, connected to a ground contact 42 a (e.g., solder bump) or othergrounding element, through an electrical interconnect 20 within thesubstrate panel 14.

In a MAPBGA package, for example, traces and contacts of plating busesmay be exposed at the edge of the substrate panel 14 along the lateralsides 52 of the singulated device package 48 b. Positioning the bridgingsection 30 such that the terminal end 50 of the conductive component 28b is elevated above the surface 18 of the substrate panel, provides aclearance between the conductive shield 54 over the terminal end 50 andexposed traces and contacts in the substrate panel 14 to avoid shortingof the electrical components.

In use, the external contacts 42, 42 a can be mounted on a PCB (notshown), for example, and electrically connected to a ground voltageprovided by the PCB. The connection between the conductive component 28b, the contact pad 16 b, the electrical interconnect 20 and the groundelectrical contact 42 a, provides an electrical pathway to groundelectromagnetic and/or radiofrequency energy incident upon the shieldinglayer 54.

The conductive shielding layer 54 can be formed from a conductivepolymer, metal, metal alloy (e.g., ferromagnetic or ferroelectricmaterial), or other suitable electrically conductive material. Forexample, in embodiments, the conductive shielding material can be formedfrom aluminum (Al), copper (Cu), stainless steel, chromium (Cr), tin(Sn), gold (Au), silver (Ag), nickel (Ni), zinc (Zn), or other metal, ora conductive polymer such as electrically conductive particle filledpolymeric resin or RFI/EMI shielding polymers (e.g., Ag or Ni filledepoxy or urethane), or combinations thereof. In embodiments, theconductive shield 54 can be multi-layered.

In an embodiment, the conductive shielding layer 54 can be applied as aconformal coating over a portion of the singulated device package 48 b.The conductive shielding material can be formed over the surface of 56the encapsulant 40, for example, by physical vapor deposition (PVD),chemical vapor deposition (CVD), atomic layer deposition (ALD),electrolytic plating, electroless plating, spraying, vacuummetallization, printing, painting, lamination, and dipping, among otherprocesses. The thickness of the conductive shielding layer 54 depends,at least in part, on the desired shielding effect. In an embodiment, theconductive shielding layer 54 can have a thickness of about 2-200microns.

For example, referring to FIG. 11, a conformal shielding layer can beapplied utilizing a bath 58 of a conductive liquid (e.g., a conductivepolymer, paint, ink, molten metal, or metal particle-containing liquid).For example, in an embodiment, the encapsulated device package 48 b canbe partially immersed in a bath 58 containing a conductive polymer tocoat portions of the surface 56 of the package including the top surface(shown facing down in FIG. 11), and portions of the side surfaces thatinclude the terminal end 50 of the conductive component 28 b (but notthe substrate panel 14). The coated package can then be exposed toinfrared light, ultraviolet light or heat to cure the conductive polymershield coating 54 on the package.

In another embodiment, a conformal metal layer can be plated onto theouter surface 56 of the device package 48 b by a conventionalelectroplating or electroless plating process. A thin seed layer (notshown) can first be deposited onto the surface 56 of the device packageby CVD, PVD, or a plating process. Then, as shown in FIG. 11, the devicepackage 48 b can be inverted and dipped in a bath 58 containing anaqueous solution of a metal salt. The package 486 b is immersed in thebath to a level up to and covering the terminal end 50 of the conductivecomponent 28 b. A current is then applied to the bath 58 to reduce themetal ions and deposit a metal layer onto the seed layer (not shown) toform the conductive shielding layer 54, as shown in FIG. 10. The devicepackage remains immersed in the solution bath 58 with the currentapplied until the desired thickness of the shielding layer 54 isobtained.

In another embodiment of a plating system, an electroless platingprocess can be used to deposit a metal layer (e.g., silver, copper) overthe surfaces of the encapsulated device package 48 b. For example,referring again to FIG. 11, the encapsulated device package 48 b can beimmersed in a bath 58 comprising an aqueous solution of a metal salt anda chemical reducing agent (e.g., potassium hypophosphite, formaldehyde,potassium borohydride, hydrazine, ascorbic acid) reacts with the metalions to deposit a metal layer onto a seed layer to a desired thickness.

In the illustrated embodiment in FIG. 11, the terminal end 50 of theconductive component 28 b is situated at a distance (d) from the surface18 of the substrate 14. The substrate panel 14 and at least a portion ofthe section of encapsulant 60 between the terminal end 50 and thesubstrate panel are not immersed in the bath 58, and are left uncoatedto avoid shorting the terminal end 50 with electrical components in oron the substrate panel 14. In an embodiment, to prevent application ofthe shield material onto the substrate panel 14, the substrate panel 14and at least a portion of the section of encapsulant 60 can be coveredby an appropriate removable masking material (not shown). The maskingmaterial can be applied, for example, by spraying the material onto thesubstrate panel 14 and a portion of section 60, for example through apatterned mask, by dipping the substrate panel 14 and section 60 into abath containing the masking material, or by application of a thickadhesive tape.

Referring now to FIG. 12, another embodiment of device package 148 a isillustrated in which the conductive component 128 a is connected througha wire bond 138 b to a contact pad 126 on a die 112 a. The contact pad126 is, in turn, connected through a wire bond 138 a to a ground contactpad 116 b on the substrate panel 114. As shown, the ground contact pad116 b can be connected through an interconnect 120 extending through thesubstrate panel 114 to an external ground contact 142 a (e.g., ballcontact on bump).

FIG. 13 illustrates another embodiment of device package 248 a in whichthe conductive component 228 a is grounded through a conductive bondingmaterial 232 that is applied to the substrate panel onto a conductiveinterconnect (via) 220 or onto a pad 216 b connected to the conductiveinterconnect. The interconnect 220 extends through the substrate panel214 to a ground contact pad 221 a on which an external ground contact242 a is mounted on an opposing side of the substrate panel. Theconductive bonding material 232 can be, for example, solder, aconductive polymer material (e.g., a silver filled epoxy), or anothersuitable material.

In another embodiment, the inventive subject matter may be implementedin a flat no-leads device package such as a quad-flat no-leads (QFN)package or a dual-flat no-leads (DFN) package, incorporating aconductive component attached to and grounded by a lead of the package.FIG. 14 depicts an embodiment of a device panel 362 composed of aplurality of leadframe modules 364 a, 364 b, which will be separatedinto individual flat no-leads device packages (e.g., a QFN or DFN devicepackage). A QFN or DFN device package typically includes a die 312 a,312 b, which may be mounted on a flag 366 a, 366 b of each leadframemodule 364 a, 364 b. Each leadframe module 364 a, 364 b also includes aplurality of leads 368 that are exposed at the bottom surface of thedevice panel 362 of and positioned generally around the perimeter ofeach device, once singulated (e.g., along two or four edges of theperimeter).

In the illustrated embodiment in FIG. 14, the leadframe panel 362includes a plurality of flags 366 a, 366 b and outwardly extending leads368, with the leads of adjoining leadframe modules 364 a, 364 b beingconnected together across the saw streets 342. A die 312 a, 312 b can bemounted via a bonding material (not shown) to the flags 366 a, 366 b,respectively. In other embodiments, the dies 312 a, 312 b are adhered toa process supporting tape during assembly, and the flags 366 a, 366 bmay be excluded. Each die is connected by bonding wires 338 a to theleads 368 of the leadframe panel. According to an embodiment, aconductive component 328 can be mounted via a bonding material 332 on alead 368 of each of the leadframe modules 364 a, 364 b. For example, thebonding material 332 may be non-conductive, and the conductive component328 may be electrically connected by a bonding wire 338 b to a lead 368,which in turn may be connected to ground when the singulated device isincorporated into a larger electrical system. Alternatively, the bondingmaterial 332 may be conductive (e.g., solder or a conductive epoxy), andbonding wire 338 b may be excluded. As shown in FIG. 14, the dies 312 a,312 b, leads 368 and conductive components 328 are then encapsulatedwith a molding compound 340. The encapsulated leadframe panel 362 canthen be cut, sawn or otherwise singulated along saw streets 342. Thesingulation process cuts through the encapsulant 340, the conductivecomponents 328, and the leads 368 between adjoining leadframe modules364 a, 364 b.

As shown in FIG. 15, a singulated, device package 348 a includes theleads 368 and a section 328 a of the conductive component, which areexposed along a lateral side 346 of the device package. The surface 356of the device package 348 a and the exposed terminal ends 350 of theconductive component 328 a, but not the leads 368, can then be coatedwith a conductive shield layer 354, as described herein.

As mentioned above, in embodiments in which the conductive component 328is mounted using a conductive bonding material 332, bonding wires 338 bcan be eliminated. In such an embodiment, the shielding layer 354 may beelectrically coupled to the PCB ground through the conductive component328 a, the bonding wire 338 b (or conductive bonding material 332), andthe lead 368.

In another embodiment, the inventive subject matter may be embodied inan encapsulated device package in the form of a fan out wafer levelpackage (FO-WLP), which incorporates conductive components and bears aconductive shield coating over the surface of the package. A FO-WLP maybe implemented without wire bonding, and using die contact pads andconductive structures in one or more dielectric layers to electricallycouple a die to device contacts. In general, in a FO-WLP, multiple dieare encapsulated together in a panel, and routing of signals, power, andground are provided in conductive and dielectric layers that are builtdirectly on the panel.

Referring to FIG. 16 in forming a FO-WLP package according to anembodiment, a device panel 470 can be created by temporarily attachingdies 412 a, 412 b (contact side down) and conductive components 428 to afirst (temporary) substrate 472, with the conductive components 428situated between the dies 412 a, 412 b, and extending between adjacentpackage areas. The dies 412 a, 412 b and conductive components 428 canbe encapsulated in a molding compound 440 and the temporary substrate472 removed.

As depicted in FIG. 17, one or more signal, power and ground planes canthen be formed on the surface of the panel 464 at which the contacts ofthe dies 412 a, 412 b and conductive components 428 are exposed. Theprocess comprises forming a multilayer substrate panel 414 by depositionof a plurality of electrically conductive layers and insulation layers,where the conductive layers are patterned to form routing traces. Theconductive components 428 and contact pads 426 on the dies 412 a, 412 bare electrically connected to the surface 444 of the substrate 414through the routing traces in the conductive layer(s) and conductivevias (interconnects) 468 extending through the insulation layers of thesubstrate 414 to contact pads 420 at the exposed surface 444 of thesubstrate panel 414. External contacts 442 can then be formed, includingground contacts 442 a which are electrically connected to the conductivecomponents 428 through pads 420, vias 468, and conductive routing in thepatterned conductive layer(s) of the substrate 414. The panel 464 canthen be singulated along saw streets 446 to form individual devicepackages 448 a, 448 b. Referring to FIG. 18, a conductive shield layer454 can then be applied as described herein to cover the terminal endsof the conductive components 428 a, 428 b exposed at the lateral sidesof the singulated device package 448 a.

It should be appreciated that the detailed description is intended toencompass numerous embodiments. For example, the various embodimentsrelate to encapsulated semiconductor device packages, each including oneor more semiconductor die and a conductive component coupled to asubstrate, an encapsulant surrounding the die and the conductivecomponent except for an end of the conductive component at a lateralside of the package, and a conductive shield layer overlying theencapsulant and the exposed end of the conductive component. Inembodiments, the conductive shield layer overlies the conductivecomponent and is distanced from a surface of the substrate. Inembodiments, the conductive component within the singulated devicepackage has a partial arch shape. In embodiments, the conductivecomponent is a pre-formed element. In embodiments, the conductivecomponent is coupled to the substrate with a conductive bondingmaterial. In embodiments, the conductive component is electricallycoupled through one or more conductive vias extending through thesubstrate to a ground contact pad on an opposing side of the substrate.In other embodiments, the conductive component is formed in-situ on thesubstrate. In embodiments, the conductive component is wire bonded to aground contact pad on the substrate. In other embodiments, theconductive component is wire bonded to a contact pad on the die, and thecontact pad on the die is wire bonded to a ground contact pad on thesubstrate. In embodiments, the conductive component is mounted on andelectrically coupled to a lead of a leadframe. In embodiments, thedevice package is a BGA package, a flat no-leads device package, or aFO-WLP package. In embodiments, the conductive shield layer is at leastone of an electromagnetic interference shield and a radio frequencyshield.

Other embodiments include methods of making a packaged semiconductordevice, which includes providing a substrate panel having a plurality ofdies thereon, providing a conductive component between two adjacentdies, encapsulating the plurality of dies and the conductive component,singulating the resulting panel to form individual device packages whichincludes cutting through the conductive component between the twoadjacent dies such that that each singulated device package contains atleast one die and a portion of the conductive component with an end ofthe conductive component exposed along a lateral side of the devicepackage, and forming a conductive shield layer over the encapsulant ofthe device package including the exposed end of the conductivecomponent. In embodiments, the conductive shield layer covers theexposed end of the conductive component and is distanced from a surfaceof the substrate panel. In embodiments, prior to singulation, theconductive component between the two adjacent dies is arch shaped with abridging section extending between the package areas corresponding toeach of the dies. In embodiments, providing the conductive componentcomprises mounting a pre-formed conductive component on the substratepanel between the two adjacent dies. In embodiments, the conductivecomponent is mounted by a conductive bonding material and iselectrically coupled to a conductive via extending through the substratepanel to a ground contact pad on an opposing side of the substratepanel. In embodiments, the method further includes wire bonding theconductive component to a ground contact pad on the substrate. Inembodiments, the method further includes wire bonding the conductivecomponent to a contact pad on each of the two adjacent dies, and wirebonding each of the contact pads of each of the two adjacent dies toseparate ground contact pads on the substrate panel. In embodiments,providing the conductive component comprises mounting a pre-formedconductive component on a lead of a leadframe, and wire bonding theconductive component to a lead of the leadframe. In embodiments, formingthe conductive shield layer comprises immersing the singulated devicepackage including the exposed end of the conductive component in aconductive polymer or plating solution such that the substrate is leftuncoated. In embodiments, the singulated device package is immersed in aplating or polymer solution such that the substrate and a sectionbetween the exposed terminal end and the substrate are left uncoated.

The terms “top,” “bottom,” “over,” “under,” “overlying,” “underlying,”and the like in the description and in the claims, if any, are used fordescriptive purposes and not necessarily for describing permanentrelative positions. It is understood that the terms so used areinterchangeable under appropriate circumstances such that theembodiments of the invention described herein are, for example, capableof operation in other orientations than those illustrated or otherwisedescribed herein.

The terms “a” or “an,” as used herein, are defined as one or more thanone. Also, the use of introductory phrases such as “at least one,” “atleast two,” and “one or more” in the claims should not be construed toimply that the introduction of another claim element by the indefinitearticles “a” or “an” limits any particular claim containing suchintroduced claim element to devices, etc., containing only one suchelement, even when the same claim includes the introductory phrases “oneor more” or “at least one” and indefinite articles such as “a” or “an.”The same applies to the use of definite articles.

Although the description refers to specific embodiments, variousmodifications and changes can be made without departing from the scopeof the inventive subject matter as set forth in the claims below.Accordingly, the specification and figures are to be regarded in anillustrative rather than a restrictive sense, and all such modificationsare intended to be included within the scope of the inventive subjectmatter. Any benefits, advantages, or solutions to problems that aredescribed herein with regard to specific embodiments are not intended tobe construed as a critical, required or essential feature or element ofany or all of the claims.

What is claimed:
 1. A method of making a semiconductor device package,the method comprising: providing a substrate panel having a plurality ofdies coupled on and directly to a top surface of the substrate panel onadjacent package areas of the substrate panel; providing a conductivecomponent coupled on and directly to said top surface of the substratepanel, the conductive component spanning the adjacent package areas, theconductive component having a rigid structure in an arched or blockconfiguration and coupled to a ground element; wherein the plurality ofdies and the conductive component are coupled to a common surface of thesubstrate panel; applying an encapsulant over and in direct contact withthe plurality of dies and the conductive component to produce a devicepanel; singulating the encapsulated device panel to provide separate,individual device packages having a top surface and lateral sidesurfaces, wherein said singulating includes cutting through theencapsulant, the conductive component between the adjacent package areasand the substrate panel such that each device package contains at leastone die and a portion of the conductive component with an end of theconductive component exposed along a lateral side surface of the devicepackage and distanced from said top surface of the substrate panel; andapplying a conductive shield material onto the singulated device packageto form a layer as a conformal coating over and in contact with the topsurface and the lateral side surfaces of the encapsulated and singulateddevice package including the exposed end of the conductive component;wherein the conductive shield layer is in contact with the exposed endof the conductive component but not with the substrate panel, and aportion of the lateral side surface of the encapsulated device packagebetween the exposed end of the conductive component and said top surfaceof the substrate panel is not covered by the conductive shield layersuch that the conductive shield layer is distanced from said top surfaceof the substrate panel.
 2. The method of claim 1, wherein the conductivecomponent between the adjacent package areas is arch shaped with abridging section extending between the adjacent package areas.
 3. Themethod of claim 1, wherein providing the conductive component comprisesmounting a pre-formed conductive component on the substrate panelbetween the dies.
 4. The method of claim 1 wherein the conductivecomponent has a width of at least 25 microns to 500 microns, and alength of at least 300 microns to 5000 microns.
 5. The method of claim1, wherein the end of the conductive shield layer is separated from asurface of the substrate by a distance, and the distance between theconductive shield layer and the surface of the substrate is in a rangeof 5 microns to 250 microns.
 6. The method of claim 1, wherein theconductive component of the individual device package has a partial archshape.
 7. The method of claim 1, further comprising coupling theconductive component as a pre-formed element to the substrate.
 8. Themethod of claim 1, further comprising coupling the conductive componentto the substrate with a conductive bonding material.
 9. The method ofclaim 1, further comprising fabricating the conductive component in-situon the substrate.
 10. The method of claim 1, wherein the conductivecomponent is mounted on a lead of a leadframe.
 11. The method of claim1, wherein the device package is selected from a ball grid arraypackage, a flat no-leads device package, and a fan out wafer levelpackage.
 12. The method of claim 1, wherein the conductive shield layeris at least one of an electromagnetic interference shield and a radiofrequency shield.
 13. The method of claim 9, wherein fabricating theconductive component in situ is by a process selected from the groupconsisting of a deposition process, an electroplating process, alamination technique, and a printing process.
 14. A method of making asemiconductor device package, the method comprising: providing asubstrate panel having a plurality of dies coupled on and directly to atop surface of the substrate panel on adjacent package areas of thesubstrate panel; providing a conductive component coupled on anddirectly to said top surface of the substrate panel, the conductivecomponent spanning the adjacent package areas, the conductive componenthaving a rigid structure in an arched or block configuration and coupledto a ground element; wherein the plurality of dies and the conductivecomponent are coupled to a common surface of the substrate panel;applying an encapsulant over and in direct contact with the plurality ofdies and the conductive component to produce a device panel; singulatingthe encapsulated device panel to provide separate, individual devicepackages having a top surface and lateral side surfaces, wherein saidsingulating includes cutting through the encapsulant, the conductivecomponent between the adjacent package areas and the substrate panelsuch that each device package contains at least one die and a portion ofthe conductive component with an end of the conductive component exposedalong a lateral side surface of the device package and distanced fromsaid top surface of the substrate panel; and applying a conductiveshield material onto the singulated device package to form a conductiveshield layer as a conformal coating over and in contact with the topsurface and the lateral side surfaces of the encapsulated and singulateddevice package including the exposed end of the conductive component;wherein forming the conductive shield layer comprises immersing thepackage including the exposed end of the conductive component in aplating or polymer solution such that the substrate and the portion ofthe lateral side surface between the exposed end of the conductivecomponent and said top surface of the substrate panel are left uncoated;and wherein the conductive shield layer is in contact with the exposedend of the conductive component but not with the substrate panel, and aportion of the lateral side surface of the encapsulated device packagebetween the exposed end of the conductive component and said top surfaceof the substrate panel is not covered by the conductive shield layersuch that the conductive shield layer is distanced from said top surfaceof the substrate panel.
 15. A method of making a semiconductor devicepackage, the method comprising: providing a device panel having aplurality of dies and a conductive component encapsulated within anencapsulant, wherein the conductive component and contact pads of theplurality of dies are exposed at a first surface of the encapsulant, andthe conductive component has a rigid structure in an arched or blockconfiguration and extends across a saw street between adjacent packageareas; forming a substrate panel composed of a plurality of conductiveand insulating layers over the first surface of the encapsulant, whereinthe plurality of conductive and insulating layers electrically couplethe contact pads and the conductive component with conductiveinterconnects at a top surface of the substrate panel, and theconductive component is on and in direct contact with the top surface ofthe substrate panel; singulating the device panel and substrate panel toprovide individual device packages having a top surface and lateral sidesurfaces, wherein said singulating includes cutting through theencapsulant and the conductive component between the adjacent packageareas such that each device package contains at least one die and aportion of the conductive component with an end of the conductivecomponent exposed along a lateral side surface of the device package anddistanced from the top surface of the substrate panel; and applying aconductive shield material onto the singulated device package to form alayer as a conformal coating over and in contact with the top surfaceand the lateral side surfaces of the device package; wherein theconductive shield layer is in contact with the exposed end of theconductive component but not with the substrate panel, and a portion ofthe lateral side surface of the device package between the exposed endof the conductive component and the top surface of the substrate is notcovered by the conductive shield layer such that the conductive shieldlayer is distanced from the top surface of the substrate panel.
 16. Themethod of claim 15, wherein the conductive component between theadjacent package areas is arch shaped with a bridging section extendingbetween the adjacent package areas.
 17. The method of claim 15 whereinthe conductive component has a width of at least 25 microns to 500microns, and a length of at least 300 microns to 5000 microns.
 18. Amethod of making a semiconductor device package, the method comprising:providing a device panel having a plurality of lead frame modules, a diecoupled to a flange of each leadframe module, a lead exposed at asurface of the device panel and extending across a saw street betweenadjacent leadframe modules, the lead having a top surface, and aconductive component having a rigid structure in an arched or blockconfiguration coupled to the lead and extending across said saw streetbetween said adjacent lead frame modules; encapsulating the dies, leadand conductive component with encapsulant; singulating the device panelby cutting along the saw street through the encapsulant, the conductivecomponent and lead to provide individual device packages such that eachdevice package has a top surface and lateral side surfaces and containsat least one die and a portion of the conductive component with an endof the conductive component and an end of the lead exposed along alateral side surface of the device package, and the exposed end of theconductive component is distanced from the top surface of the lead; andapplying a conductive shield material onto the singulated device packageto form a layer as a conformal coating over and in contact with the topsurface and the lateral side surfaces of the encapsulant and the exposedend of the conductive component but not the exposed end of the lead;wherein the conductive shield layer is in contact with the exposed endof the conductive component but not with the lead, and a portion of thelateral side surface of the device package between the exposed end ofthe conductive component and the top surface of the lead is not coveredby the conductive shield layer such that the conductive shield layer isdistanced from the top surface of the lead.